Particles detection and analysis of hard disk substrate after cleaning of post chemical mechanical polishing

被引：18

作者：

Huang, Yating ^{[1
]}

Lu, Xinchun ^{[1
]}

Pan, Guoshun ^{[1
]}

Lee, Bill ^{[2
]}

Luo, Jianbin ^{[1
]}

机构：

[1] Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China

[2] Shenzhen Kaifa Megnet Recording Co Ltd, Shenzhen, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2009年 / 255卷 / 22期

基金：

中国国家自然科学基金;

关键词：

Hard disk; Post-CMP cleaning; Particle contamination; ADHESION; REMOVAL; ROUGH;

D O I：

10.1016/j.apsusc.2009.06.120

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Scrub, ultrasonic and megasonic are widely used in industry as post-CMP (chemical mechanical polishing/planarization) cleaning procedure. In this paper experiments and results are described to analyze the particle contaminations of hard disk substrate after each process of post-CMP cleaning. A scatter spot method has been exploited to detect the location and characteristics of the particles. SEM with EDX is used to observe and analyze the particles' shape and size as well as the elements. The results indicate that brush scrub process can remove 99% contaminations after CMP but not that efficient for submicron particle. Megasonic is a refined method for cleaning nano-particles. However, contaminations like metallic particles and bacteria from the equipment may cause pollution. The abrasive particles embedded in the plating pits cannot be removed by mechanical force. Pollution in the dryer is also discussed. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：9100 / 9104

页数：5

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