EXPERIMENTAL STUDY OF FLUID FLOW IN MICROCHANNEL

被引:0
作者
Lu, Xi [1 ]
Nnanna, A. G. Agwu [1 ]
机构
[1] Purdue Univ Calumet, Dept Mech Engn, Micro & Nanoscale Heat Transfer Lab, Hammond, IN 46323 USA
来源
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 13, PTS A AND B | 2009年
关键词
Nanofluid; manifold; microchannel; flow distribution; experiments; numerical; flow; HEAT SINK PERFORMANCE; INCOMPRESSIBLE-FLOW; NANOFLUIDS;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
This paper presents a study of fluid flow through microchannel. Based on the work of Senta and Nnanna, [23], a trapezoidal-shaped manifold is used to ensure uniform flow distribution in the microchannel. Analysis further shows that flow uniformity among the channels largely depends on shape of the manifolds, length and location of inlet and outlets, and the inlet flow rate. The test setup consists of one hundred twenty-six 14.5 mu m-width channels, flow loop, heat source, thermal sensors and pressure transducers. Flow of fluid through the channels is regulated using a peristaltic pump. Experiments were conducted from various flow rates and heat loads. According to experimental data, microchannel has significant impact in the heat transfer rate for all the flow rates considered. This enhancement could be attributed to laminar flow in the microchannels, conduction heat transfer through the walls of the channel, fluid-channel wall interaction, and microconvection within the channel. Results show raises some concerns on the use of empirical correlations for flow between two parallel plates to predict heat transfer behavior in microchannels. In the absence of experimental data, f approximate to -2(dp/dx)d(h)/rho u(m)(2) provides a reasonable estimate of friction factor in microchannel.
引用
收藏
页码:647 / 653
页数:7
相关论文
共 24 条
[11]  
Lee S., 1996, ASME 1996 INT MECH E, P227, DOI [10.1115/IMECE1996-0161, DOI 10.1115/IMECE1996-0161]
[12]  
LIU D, 2004, AIAA J THERMOPHYS HE, V18, P65
[13]   MICROCHANNEL HEAT SINKS FOR TWO-DIMENSIONAL HIGH-POWER-DENSITY DIODE-LASER ARRAYS [J].
MISSAGGIA, LJ ;
WALPOLE, JN ;
LIAU, ZL ;
PHILLIPS, RJ .
IEEE JOURNAL OF QUANTUM ELECTRONICS, 1989, 25 (09) :1988-1992
[14]  
Nield D.A., 1992, Convection in Porous Media
[15]   Experimental model of temperature-driven nanofluid [J].
Nnanna, A. G. Agwu .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2007, 129 (06) :697-704
[16]   HEAT-TRANSFER CHARACTERISTICS OF WATER FLOWING THROUGH MICROCHANNELS [J].
PENG, XF ;
PETERSON, GP ;
WANG, BX .
EXPERIMENTAL HEAT TRANSFER, 1994, 7 (04) :265-283
[17]  
Philips R.J., 1990, Advances in Thermal Modeling of Electronic Components and Systems, P109
[18]  
SALMAN VK, 1989, J ELECT MAT, V18, P611
[19]   OPTIMAL STRUCTURE FOR MICROGROOVED COOLING FIN FOR HIGH-POWER LSI DEVICES [J].
SASAKI, S ;
KISHIMOTO, T .
ELECTRONICS LETTERS, 1986, 22 (25) :1332-1334
[20]  
Senta M., 2007, P ASME INT MECH ENG, P1