128 x 128 long-wavelength/mid-wavelength two-color HgCdTe infrared focal plane array detector with ultralow spectral cross talk

被引:210
作者
Hu, Weida [1 ]
Ye, Zhenhua [2 ]
Liao, Lei [3 ,4 ]
Chen, Honglei [2 ]
Chen, Lu [2 ]
Ding, Ruijun [2 ]
He, Li [2 ]
Chen, Xiaoshuang [1 ]
Lu, Wei [1 ]
机构
[1] Chinese Acad Sci, Shanghai Inst Tech Phys, Natl Lab Infrared Phys, Shanghai 200083, Peoples R China
[2] Chinese Acad Sci, Shanghai Inst Tech Phys, Key Lab Infrared Imaging Mat & Detectors, Shanghai 200083, Peoples R China
[3] Wuhan Univ, Minist Educ, Dept Phys, Wuhan 430072, Peoples R China
[4] Wuhan Univ, Minist Educ, Key Lab Artificial Micro & Nanostruct, Wuhan 430072, Peoples R China
关键词
NUMERICAL-ANALYSIS; PHOTODIODES; EPITAXY;
D O I
10.1364/OL.39.005184
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
High temporal and spatial coherent simultaneous long-wavelength/mid-wavelength (LW/MW) two-color focal plane array (FPA) infrared detection is the cutting-edge technique for third-generation infrared remote sensing. In this Letter, HgCdTe LW/MW two-color infrared detectors were designed and fabricated. The top long-wavelength and bottom mid-wavelength infrared planar photodiodes were processed by selective B+-implantation after etching the long-wavelength epilayer into a curvature and exposing the mid-wavelength layers for the implantation of the n region of the MW photodiode by a micro-mesa array technique. A 128 x 128 MW/LW HgCdTe infrared FPA detector is fabricated photo-lithographically by simultaneous nonplanar B+-implantation of the LW and MW photodiodes, passivation and metallization of the sidewalls, mesa isolation, and flip-chip hybridization with a read-out integrated circuit. The inner mechanisms for suppressing the cross talk and improving photoresponse have been carried out by combining experimental work with numerical simulations. (C) 2014 Optical Society of America
引用
收藏
页码:5184 / 5187
页数:4
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