Comparison of raised source/drain versus raised extension in ultra-thin body, fully-depleted-SOI, including effects of BEOL via capacitances

被引:2
作者
Egley, JL
Vandooren, A
Winstead, B
Verret, E
Workman, C
White, B
Nguyen, BY
机构
[1] Motorola Inc, Adv Prod Res & Dev Lab, Tempe, AZ 85284 USA
[2] Motorola Inc, Adv Prod Res & Dev Lab, Austin, TX 78721 USA
[3] Motorola Inc, Front End Technol Simulat, Austin, TX 78721 USA
关键词
fully depleted SOI; FDSOI; raised SD extension; raised S/D;
D O I
10.1016/j.sse.2004.03.009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Raised source/drain (S/D) or raised extension in fully-depleted-SOI (FDSOI) is necessary to boost saturation current, because of increased resistance from the very thin film. We demonstrate that the choice of raising the extension versus the S/D, will depend upon the maximum achievable mobility in the structure at a 60 nm physical gate length. We also study the effects of minimum BEOL via spacing on performance, and its consequence on choosing a raised extension or S/D. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1607 / 1612
页数:6
相关论文
共 10 条
[1]   Equations of state for silicon inversion layers [J].
Ancona, MG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2000, 47 (07) :1449-1456
[2]   An improved electron and hole mobility model for general purpose device simulation [J].
Darwish, MN ;
Lentz, JL ;
Pinto, MR ;
Zeitzoff, PM ;
Krutsick, TJ ;
Vuong, HH .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1997, 44 (09) :1529-1538
[3]  
DUNCAN A, 1996, THESIS U ILLINOIS
[4]  
LIU KC, 1997, DEVICE RES C DIGEST, V55
[5]  
NOWAK EJ, 2002, IBM J RES DEV, V46
[6]   Fully-depleted SOI devices with TaSiN gate, HfO2 gate dielectric, and elevated source/drain extensions [J].
Vandooren, A ;
Barr, A ;
Mathew, L ;
White, TR ;
Egley, S ;
Pham, D ;
Zavala, M ;
Samavedam, S ;
Schaeffer, J ;
Conner, J ;
Nguyen, BY ;
White, BE ;
Orlowski, MK ;
Mogab, J .
IEEE ELECTRON DEVICE LETTERS, 2003, 24 (05) :342-344
[7]  
Vandooren A, 2002, 2002 IEEE INTERNATIONAL SOI CONFERENCE, PROCEEDINGS, P205, DOI 10.1109/SOI.2002.1044477
[8]  
VANDOOREN A, 2003, 2003 SIL NAN WORKSH, P4
[9]   A model for specific contact resistance applicable for titanium silicide-silicon contacts [J].
Varahramyan, K ;
Verret, EJ .
SOLID-STATE ELECTRONICS, 1996, 39 (11) :1601-1607
[10]  
WINSTEAD B, 2001, THESIS U ILLINOIS