A New IC Solder Joint Inspection Method for an Automatic Optical Inspection System Based on an Improved Visual Background Extraction Algorithm

被引：63

作者：

Cai, Nian ^{[1
,2
]}

Lin, Jianfa ^{[1
]}

Ye, Qian ^{[1
]}

Wang, Han ^{[3
]}

Weng, Shaowei ^{[1
]}

Ling, Bingo Wing-Kuen ^{[1
]}

机构：

[1] Guangdong Univ Technol, Sch Informat Engn, Guangzhou 510006, Guangdong, Peoples R China

[2] First Audio Mfg Guangzhou Co Ltd, Guangzhou 510820, Guangdong, Peoples R China

[3] Guangdong Univ Technol, Sch Electromech Engn, Guangzhou 510006, Guangdong, Peoples R China

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2016年 / 6卷 / 01期

关键词：

Defect inspection; frequency map (FM); integrated circuit (IC) solder joint; statistical modeling; visual background extraction (ViBe); CLASSIFICATION; DEFECTS;

D O I：

10.1109/TCPMT.2015.2501284

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In the field of automatic optical inspection (AOI), defect recognition for an integrated circuit (IC) solder joint is a long-standing task. Inspired by a visual background extraction (ViBe) algorithm, an object detection method in computer vision, we propose a new inspection method for IC solder joints with an improved ViBe algorithm. To the best of our knowledge, we are the first to consider the defect inspection problem as an object detection problem. We build a solder joint model using the ViBe model updating scheme. Then, we compare the solder joint image with the well-trained model to detect potential defects. Finally, we introduce a frequency map method and define a metric named defect degree to evaluate the qualities of the solder joints. Experimental results show that our method is universal, accurate, and easily debugged compared with the other existing methods.

引用

页码：161 / 172

页数：12

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