Fast Prediction of Radiation from High-Speed/High-Density Connectors

被引:0
作者
Chen, Hung-Chuan [1 ]
Wu, Tzong-Lin [1 ]
Connors, Samuel [2 ]
Archambeault, Bruce [2 ]
机构
[1] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei, Taiwan
[2] IBM Corp, Res Triangle Pk, NC USA
来源
2014 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC) | 2014年
关键词
Electromagnetic radiation; S-parameter; high-speed connectors; ELECTROMAGNETIC-RADIATION;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A technique to quickly predict the electromagnetic radiation for large connector array is proposed in the paper. Based on the S-parameters from a small section of a much larger connector, the S-parameters can be expanded to characterize a connector with any number of sections by only taking the nearest two sections into account. The proposed method shows good agreement with the radiated emissions from a full-wave solver. This technique is much faster than typical full wave solvers, and, often, the complicated full connector is too large of a problem for most computer simulations. Included in the work, it is shown that the predicted radiated power from connector increases proportionally with up to 45 sections/wafers.
引用
收藏
页码:256 / 259
页数:4
相关论文
共 30 条
  • [21] Ultrawideband Mitigation of Simultaneous Switching Noise and EMI Reduction in High-Speed PCBs Using Complementary Split-Ring Resonators
    Bait-Suwailam, Mohammed M.
    Ramahi, Omar M.
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2012, 54 (02) : 389 - 396
  • [22] Numerical Investigation of Glass-Weave Effects on High-Speed Interconnects in Printed Circuit Board
    Tian, Xinxin
    Zhang, Yao-Jiang
    Lim, Jane
    Qiu, Kelvin
    Brooks, Rick
    Zhang, Ji
    Fan, Jun
    2014 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2014, : 475 - 479
  • [23] A novel method for separability of signal components to estimate radiation from a high-frequency subsystem
    Daneshvar, Milad
    Parhizgar, Naser
    Oraizi, Homayoon
    ARCHIVES OF ELECTRICAL ENGINEERING, 2019, 68 (03) : 498 - 511
  • [24] A STUDY OF HIGH-FREQUENCY PROPERTIES OF PLASMA AND THE INFLUENCE OF ELECTROMAGNETIC RADIATION FROM IR TO XUV
    Sreckovic, Vladimir A.
    Sulic, Desanka M.
    Ignjatovic, Ljubinko M.
    Dimiirijevic, Milan S.
    NUCLEAR TECHNOLOGY & RADIATION PROTECTION, 2017, 32 (03) : 222 - 228
  • [25] Use of high-strength electromagnetic radiation to remove phototrophic biofilms from terracotta artifacts
    Cennamo, Paola
    Pasquino, Nicola
    Guarino, Vincenza
    Morra, Vincenzo
    Giorgio, Antonella
    Caputo, Paolo
    Moretti, Aldo
    ENVIRONMENTAL SCIENCE AND POLLUTION RESEARCH, 2018, 25 (29) : 29654 - 29662
  • [26] Use of high-strength electromagnetic radiation to remove phototrophic biofilms from terracotta artifacts
    Paola Cennamo
    Nicola Pasquino
    Vincenza Guarino
    Vincenzo Morra
    Antonella Giorgio
    Paolo Caputo
    Aldo Moretti
    Environmental Science and Pollution Research, 2018, 25 : 29654 - 29662
  • [27] A proposal of simple calculations for the ground clearance size beneath the SMT chip pad on the high-speed digital circuits
    Nara, Shigeo
    Journal of Japan Institute of Electronics Packaging, 2012, 15 (06) : 461 - 469
  • [28] Pico-second signal transient characterization technique of meanders through S-parameter measurement in high-speed PWB interconnects
    Kim, YJ
    Kim, JH
    Ryu, HS
    Suh, YS
    Wee, JK
    Chun, HS
    Ki, JS
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1463 - 1467
  • [29] S-parameter-measurement-based high-speed signal transient characterization of VLSI interconnects on SiO2-Si substrate
    Eo, Y
    Eisenstadt, WR
    Shim, J
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (03): : 470 - 479
  • [30] A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects
    Li, EP
    Liu, EX
    Li, LW
    Leong, MS
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (01): : 213 - 223