Fast Prediction of Radiation from High-Speed/High-Density Connectors

被引:0
|
作者
Chen, Hung-Chuan [1 ]
Wu, Tzong-Lin [1 ]
Connors, Samuel [2 ]
Archambeault, Bruce [2 ]
机构
[1] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei, Taiwan
[2] IBM Corp, Res Triangle Pk, NC USA
来源
2014 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC) | 2014年
关键词
Electromagnetic radiation; S-parameter; high-speed connectors; ELECTROMAGNETIC-RADIATION;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A technique to quickly predict the electromagnetic radiation for large connector array is proposed in the paper. Based on the S-parameters from a small section of a much larger connector, the S-parameters can be expanded to characterize a connector with any number of sections by only taking the nearest two sections into account. The proposed method shows good agreement with the radiated emissions from a full-wave solver. This technique is much faster than typical full wave solvers, and, often, the complicated full connector is too large of a problem for most computer simulations. Included in the work, it is shown that the predicted radiated power from connector increases proportionally with up to 45 sections/wafers.
引用
收藏
页码:256 / 259
页数:4
相关论文
共 50 条
  • [1] Investigation of the Radiated Emissions From High-Speed/High-Density Connectors
    Chen, Hung-Chuan
    Connor, Samuel
    Halligan, Matthew S.
    Tian, Xinxin
    Li, Xiao
    Archambeault, Bruce
    Drewniak, James L.
    Wu, Tzong-Lin
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2016, 58 (01) : 220 - 230
  • [2] A better technique using multisegment modeling and analysis of high-density and high-speed connectors
    Kao, CH
    Tseng, CC
    Lee, FM
    Lai, MF
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (01): : 140 - 148
  • [3] Narrow pitch connectors support high-speed communication and high-density parts mounting
    Katoh, Matsuo
    JEE. Journal of electronic engineering, 1988, 25 (261): : 36 - 38
  • [4] Investigation of the Radiation Mechanism for High-Speed Connectors
    Wang, Xu
    Cao, Ying S.
    Jiang, Lijun
    Ruehli, Albert E.
    He, Shiquan
    Zhao, Huapeng
    Hu, Jun
    Fan, Jun
    Drewniak, James. L.
    2017 IEEE 26TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2017,
  • [5] Modeling and analyzing high-speed and high-density connectors by using multisegment multiple transmission lines model
    Zhang, Mu-Shui
    Li, Yu-Shan
    Li, Li-Ping
    Jia, Chen
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (01): : 203 - 210
  • [6] Radiation Physics and Design Guidelines of High-Speed Connectors
    Li, Jing
    Fan, Jun
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2016, 58 (04) : 1331 - 1338
  • [7] BICMOS, A TECHNOLOGY FOR HIGH-SPEED HIGH-DENSITY ICS
    KLOSE, H
    ZEHNER, B
    WIEDER, A
    PROCEEDINGS - IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN : VLSI IN COMPUTERS & PROCESSORS, 1989, : 304 - 309
  • [8] BICMOS, A TECHNOLOGY FOR HIGH-SPEED HIGH-DENSITY ICS
    ZEHNER, B
    KLOSE, H
    FEIGE, D
    WIEDER, A
    SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1988, 17 (06): : 278 - 283
  • [9] BICMOS, a technology for high-speed/high-density ICs
    Zehner, Bernd
    Klose, Helmut
    Wieder, Armin
    Feige, Dieter
    Siemens Forschungs- und Entwicklungsberichte/Siemens Research and Development Reports, 1988, 17 (06): : 278 - 283
  • [10] Design of high-density interconnects for high-speed transmission
    Fu, Wanlin
    Kimura, Makoto
    Okada, Kenichi
    Sakai, Jun
    Masu, Kazuya
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 352 - +