Investigation on critical strain of dynamic recrystallization for SiCp/Al-Cu composite

被引:0
|
作者
Sun, Yali
Xie, Jingpei [1 ]
Hao, Shiming [3 ]
Wang, Aiqin [1 ,2 ]
Liu, Pei [1 ]
Li, Min [1 ]
机构
[1] Henan Univ Sci & Technol, Sch Mat Sci & Engn, Luoyang 471023, Peoples R China
[2] Collaborat Innovat Ctr Nonferrous Mat Henan Prov, Luoyang 471023, Peoples R China
[3] Henan Univ Sci & Technol, Sch Phys & Engn, Luoyang 471023, Peoples R China
关键词
MARTENSITIC STAINLESS-STEEL; HOT DEFORMATION; FLOW-STRESS; BEHAVIOR; MODEL;
D O I
10.1088/1757-899X/87/1/012046
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Using Gleeble-1500D simulator, the critical strain of dynamic recrystallization of SiCp/Al-Cu composite were investigated at 623-773 K with strain rate of 0.01-10 s(-1). The results show that the main softening mechanism is the dynamic recrystallization through the stress-strain curves of SiCp/Al-Cu composite, the activation energy is 272.831 KJ/mol. ln theta-epsilon and (-partial derivative(ln theta)/partial derivative epsilon)-epsilon) curves were plotted based on the experimental data to further obtain the critical strain and steady strain of DRX. Then the critical strain model and the steady-state strain model of DRX were set up. Furthermore, the dynamic recrystallization volume fraction of SiCp/Al-Cu composite was investigated.
引用
收藏
页数:9
相关论文
共 50 条
  • [31] Electromagnetic welding of Al-Cu: An investigation on the thickness of sheets
    Ayaz, M.
    Khandaei, M.
    Vahidshad, Y.
    KOVOVE MATERIALY-METALLIC MATERIALS, 2021, 59 (04): : 217 - 229
  • [32] Computational investigation of constitutional liquation in Al-Cu alloys
    Jiang, C
    Liu, ZK
    ACTA MATERIALIA, 2003, 51 (15) : 4447 - 4459
  • [33] SiCP/Al-Cu复合材料的高温热变形行为
    程明阳
    郝世明
    谢敬佩
    王爱琴
    马窦琴
    孙亚丽
    材料工程, 2017, 45 (02) : 17 - 23
  • [34] Effect of activated slip systems on dynamic recrystallization during rotary swaging of electro-conductive Al-Cu composites
    Kuncicka, Lenka
    Kocich, Radim
    MATERIALS LETTERS, 2022, 321
  • [35] Critical conditions of dynamic recrystallization of TiC/Cu-Al2O3 composites
    School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang
    471023, China
    不详
    471023, China
    Fuhe Cailiao Xuebao, 4 (963-969):
  • [36] MOLECULAR DYNAMIC MODELING OF PLASTICITY OF Al AND Al-Cu ALLOYS UNDER DYNAMIC LOADING
    Stegailov, Vladimir V.
    Kuksin, Alexey Yu.
    Norman, Genri E.
    Yanilkin, Alexey V.
    SHOCK COMPRESSION OF CONDENSED MATTER - 2009, PTS 1 AND 2, 2009, 1195 : 781 - 784
  • [37] Effect of activated slip systems on dynamic recrystallization during rotary swaging of electro-conductive Al-Cu composites
    Kunčická, Lenka
    Kocich, Radim
    Materials Letters, 2022, 321
  • [38] Critical Conditions of Dynamic Recrystallization for B4Cp/6061Al Composite
    Liu Shengpu
    Li Defu
    Guo Shengli
    RARE METAL MATERIALS AND ENGINEERING, 2017, 46 (07) : 1815 - 1820
  • [39] SERRATED YIELDING AND OCCURRENCE OF STRAIN GRADIENTS IN AN AL-CU ALLOY
    MCCORMICK, PG
    SCRIPTA METALLURGICA, 1972, 6 (12): : 1133 - 1138
  • [40] Shear strain induced recrystallization/recovery phenomena within rotary swaged Al/Cu composite conductors
    Kuncicka, Lenka
    Kocich, Radim
    Jambor, Michal
    MATERIALS CHARACTERIZATION, 2022, 194