Using ion beam analysis in determining the mechanisms of cleavage in hydrogen ion implanted Si

被引:4
|
作者
Nastasi, M
Höchbauer, T
Verda, RD
Misra, A
Lee, JK
Mayer, JW
Lau, SS
机构
[1] Los Alamos Natl Lab, Div Mat Sci & Technol, Los Alamos, NM 87545 USA
[2] Arizona State Univ, Tempe, AZ USA
[3] Univ Calif San Diego, La Jolla, CA 92093 USA
来源
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS | 2004年 / 219卷
关键词
ion beam analysis; ion-cut; ion implantation;
D O I
10.1016/j.nimb.2004.01.128
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Hydrogen ion implantation in Si has been shown to be an effective means of inducing cleavage in Si and facilitating the transfer of thin slices to other substrates, a process known as Ton-C,ut. Qualitatively it is known that implanted hydrogen in Si evolves under heating to form H, gas bubbles with high internal pressure, which then drives the cleavage process. However, a fundamental understanding of how the physics of ion implantation influence this process is still evolving. In this work we describe how ion channeling and elastic recoil detection studies can be used to gain a more complete understanding of how the ion damage and H concentration profile contribute to the mechanisms of cleavage in hydrogen ion implanted Si. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:604 / 610
页数:7
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