Effect of Passivation Potential on Passive Behavior and Corrosion Resistance of Ni-Cu-P Amorphous Coating in Alkaline Solution

被引:11
作者
Chen, Jie [1 ]
Zou, Yong [1 ]
Matsuda, Kenji [2 ]
Zhao, Guanlin [1 ]
机构
[1] Shandong Univ, Key Lab Liquid Struct & Hered Mat, Minist Educ, Jinan 250061, Shandong, Peoples R China
[2] Toyama Univ, Dept Mat Sci & Technol, Fac Engn, Toyama 9308555, Japan
基金
中国国家自然科学基金;
关键词
Ni-Cu-P; Amorphous coating; Corrosion resistance; Passive films; XPS; FILMS; NICKEL; COPPER; ALLOYS; STEEL;
D O I
10.20964/2017.02.04
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Corrosion resistance and passive behavior of electroless Ni-Cu-P amorphous coating have been investigated in 10 wt.% NaOH solution by using electrochemical impedance spectroscopy, Mott-Schottky and X-ray photoelectron spectroscopy analysis. The result that the corrosion resistance is increased firstly and then exhibits an opposite trend with the increasing passive potential is resulted from the variation of passive film on the coating. Passive films formed at lower potential possess n-type and p-type bipolar semiconductors characteristics, but the passive films formed at higher potential have only p-type semiconductor characteristics. The thickness of passive films was increased with the increase of passive potential. The corrosion resistance of passivation films is combined affected by their thickness and their semiconductor type.
引用
收藏
页码:1348 / 1361
页数:14
相关论文
共 39 条
[1]   PREPARATION AND SURFACE SPECTROSCOPIC CHARACTERIZATION OF OXIDE-FILMS ON TI6A14V [J].
ASK, M ;
LAUSMAA, J ;
KASEMO, B .
APPLIED SURFACE SCIENCE, 1989, 35 (03) :283-301
[2]   Study of electrochemically formed Ni(OH)(2) layers by EIS [J].
Barral, G ;
Maximovitch, S ;
NjanjoEyoke, F .
ELECTROCHIMICA ACTA, 1996, 41 (7-8) :1305-1311
[3]  
Chao C. Y., 2016, AGR WATER MANAGE, V166, P1
[4]   X-RAY PHOTOELECTRON-SPECTROSCOPY ANALYSIS OF COPPER AND ZINC-OXIDES AND SULFIDES [J].
DEROUBAIX, G ;
MARCUS, P .
SURFACE AND INTERFACE ANALYSIS, 1992, 18 (01) :39-46
[5]   AN XPS INVESTIGATION INTO THE PASSIVITY OF AN AMORPHOUS NI-20P ALLOY [J].
DIEGLE, RB ;
SORENSEN, NR ;
CLAYTON, CR ;
HELFAND, MA ;
YU, YC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (05) :1085-1092
[6]  
DIPAOLA A, 1989, ELECTROCHIM ACTA, V34, P203
[7]   The semiconducting properties of passive films formed on AISI 316 L and AISI 321 stainless steels: A test of the point defect model (PDM) [J].
Fattah-alhosseini, A. ;
Soltani, F. ;
Shirsalimi, F. ;
Ezadi, B. ;
Attarzadeh, N. .
CORROSION SCIENCE, 2011, 53 (10) :3186-3192
[8]   Passive and transpassive behaviour of Alloy 31 in a heavy brine LiBr solution [J].
Fernandez-Domene, R. M. ;
Blasco-Tamarit, E. ;
Garcia-Garcia, D. M. ;
Garcia-Anton, J. .
ELECTROCHIMICA ACTA, 2013, 95 :1-11
[9]  
Gardner M. I., 1999, USA patent, Patent No. [5 976-956, 5976956]
[10]   Electroless deposition and some properties of Ni-Cu-P and Ni-Sn-P coatings [J].
Georgieva, J. ;
Armyanov, S. .
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2007, 11 (07) :869-876