Behavior of zirconium oxide films processed from novel monocyclopentadienyl precursors by atomic layer deposition

被引:18
作者
Kukli, Kaupo [1 ,2 ]
Niinisto, Jaakko [1 ]
Tamm, Aile [2 ]
Ritala, Mikko [1 ]
Leskela, Markku [1 ]
机构
[1] Univ Helsinki, Dept Chem, FI-00014 Helsinki, Finland
[2] Univ Tartu, Inst Phys, EE-51010 Tartu, Estonia
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2009年 / 27卷 / 01期
关键词
ZRO2; THIN-FILMS; HIGH-DIELECTRIC-CONSTANT; GATE DIELECTRICS; CYCLOPENTADIENYL PRECURSORS; STRAINED-SI; SILICON; RELIABILITY; CAPACITOR; EPITAXY; HFO2;
D O I
10.1116/1.3071844
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
ZrO(2) thin films were grown by atomic layer deposition from new cyclopentadienyl precursors on planar TiN and SiO(2)/Si substrates, as well as on silicon having deep trenches with aspect ratio of 1:60. The films demonstrated conformal growth in trenches achieving step coverage of 80%-90%. ZrO(2) films crystallized either after exceeding threshold thickness or upon annealing dominantly in the cubic or tetragonal polymorph. Leakage current densities of (7-9) x 10(-8) A/cm(2) at capacitance equivalent oxide thicknesses of 0.76-0.82 nm were reached. (C) 2009 American Vacuum Society. [DOI:10.1116/1.3071844]
引用
收藏
页码:226 / 229
页数:4
相关论文
共 25 条
[1]   Processing and evaluation of metal gate/high-κ/Si capacitors incorporating Al, Ni, TiN, and Mo as metal gate, and ZrO2 and HfO2 as high-κ dielectric [J].
Abermann, S. ;
Efavi, J. K. ;
Sjoblom, G. ;
Lemme, M. C. ;
Olsson, J. ;
Bertagnolli, E. .
MICROELECTRONIC ENGINEERING, 2007, 84 (5-8) :1635-1638
[2]   Reliability of ultra thin ZrO2 films on strained-Si [J].
Bera, M. K. ;
Maiti, C. K. .
MICROELECTRONICS RELIABILITY, 2008, 48 (05) :682-692
[3]   High frequency characterization and continuum modeling of ultrathin high-k (ZrO2) gate dielectrics on strained-Si [J].
Bera, MK ;
Chakraborty, S ;
Saha, S ;
Paramanik, D ;
Varma, S ;
Bhattacharya, S ;
Maiti, CK .
THIN SOLID FILMS, 2006, 504 (1-2) :183-187
[4]   On the reliability of ZrO2 films for VLSI applications [J].
Caputo, D ;
Irrera, F .
MICROELECTRONICS RELIABILITY, 2004, 44 (05) :739-745
[5]   Influence of pre-deposition treatments on the interfacial and electrical characteristics of ZrO2 gate dielectrics [J].
Chen, Li-Min ;
Lai, Yi-Sheng ;
Chen, J. S. .
THIN SOLID FILMS, 2007, 515 (7-8) :3724-3729
[6]   New TIT capacitor with ZrO2/Al2O3/ZrO2 dielectrics for 60 nm and below DRAMs [J].
Cho, Ho Jin ;
Kim, Young Dae ;
Park, Dong Su ;
Lee, Euna ;
Park, Cheol Hwan ;
Jang, Jun Soo ;
Lee, Keum Bum ;
Kim, Hai Won ;
Ki, Young Jong ;
Han, Keun ;
Song, Yong Wook .
SOLID-STATE ELECTRONICS, 2007, 51 (11-12) :1529-1533
[7]   Property degradation of tetragonal zirconia induced by low-temperature defect reaction with water molecules [J].
Guo, X .
CHEMISTRY OF MATERIALS, 2004, 16 (21) :3988-3994
[8]   Effects of postannealing on the bulk and interfacial characteristics of ZrO2 gate dielectrics prepared on Si by metalorganic chemical vapor deposition [J].
Huang, SS ;
Wu, TB .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (06) :2702-2708
[9]   Physical and electrical characterization of high-k ZrO2 metal-insulator-metal capacitor [J].
Kim, Joo-Hyung ;
Ignatova, Velislava ;
Kuecher, Peter ;
Heitmann, Johannes ;
Oberbeck, Lars ;
Schroeder, Uwe .
THIN SOLID FILMS, 2008, 516 (23) :8333-8336
[10]   Atomic layer deposition of ZrO2 thin films with high dielectric constant on TiN substrates [J].
Kim, Seong Keun ;
Hwang, Cheol Seong .
ELECTROCHEMICAL AND SOLID STATE LETTERS, 2008, 11 (03) :G9-G11