Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies

被引：11

作者：

Ho, Cheng-Ying ^{[1
]}

Tsai, Meng-Ting ^{[1
]}

Duh, Jenq-Gong ^{[1
]}

Lee, Jyh-Wei ^{[2
,3
]}

机构：

[1] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan

[2] Ming Chi Univ Technol, Dept Mat Engn, Taipei, Taiwan

[3] Mingchi Univ Technol, Ctr Thin Film Technol & Applicat, Taipei, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2014年 / 600卷

关键词：

Metals and alloys; Intermetallics; Microstructure; Phase transitions; Nanoindentation; MECHANICAL-PROPERTIES; INTERMETALLIC COMPOUNDS; SN-3.0AG-0.5CU SOLDER; BEHAVIOR; MICROSTRUCTURE; SOLIDIFICATION; PRECIPITATION; GROWTH;

D O I：

10.1016/j.jallcom.2014.02.048

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Near eutectic SnAg and SnAgCu solders with various solder bump heights were adopted to characterize the microstructure in solder alloys. The eutectic structure was refined and the secondary dendrite arm spacing of beta-Sn decreased monotonously with the shrinkage of solder joints. Linear relationship between the secondary dendrite arm spacing and natural logarithm of the solder bump height was demonstrated in this study. The hardness and the creep deformation resistance increased with respect to the increase of solder dimension and microstructural variation due to the frequent interaction between dislocation and the precipitations in solder alloys. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：199 / 203

页数：5

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