Structural Features Of Nano-Scale Damascene Copper Lines After Annealing In Wide Temperature Range

被引：3
作者：
Konkova, T. N. [1 ,2 ]
Mironov, S. Yu. [3 ]
Ke, Y. [4 ]
Onuki, J. [1 ]
机构：
[1] Ibaraki Univ, Dept Mat Sci & Engn, Hitachi, Ibaraki 3168511, Japan
[2] Russian Acad Sci, Inst Met Superplast Problems, Ufa 450001, Russia
[3] Tohoku Univ, Grad Sch Engn, Dept Mat Proc, Sendai, Miyagi 9808579, Japan
[4] Ibaraki Univ, Grad Sch Sci & Engn, Ibaraki 3168511, Japan
来源：
PROCESSING, MATERIALS, AND INTEGRATION OF DAMASCENE AND 3D INTERCONNECTS 5 | 2014年 / 58卷 / 17期
关键词：
GRAIN-GROWTH; THIN-FILMS; CU; MICROSTRUCTURE; INTERCONNECTS; EVOLUTION; TEXTURE; STRESS; RESISTIVITY; THICKNESS;
D O I：
10.1149/05817.0029ecst
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Grain structure and texture evolved in damascene nano-scale copper lines after annealing in a wide temperature interval of 200 degrees C-500 degrees C were analyzed. Electron backscatter diffraction (EBSD) technique was used for rigorous investigation of the overburden layer, upper and bottom parts of the lines. In all cases, the microstructures were found to stabilize after achieving the same level of total grain-boundary area per unit volume. The grain growth behavior was supposed to be governed by the pinning effect of second-phase particles entrapped during the electrodeposition process.
引用
收藏
页码：29 / 36
页数：8
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