Effect of parasitic elements on UTBB FD SOI MOSFETs RF figures of merit

被引:32
作者
Arshad, M. K. Md [1 ,4 ]
Kilchytska, V. [2 ]
Emam, M. [2 ]
Andrieu, F. [3 ]
Flandre, D. [2 ]
Raskin, J. -P. [2 ]
机构
[1] Univ Malaysia Perlis, Inst Nanoelect Eng, Kangar 01000, Perlis, Malaysia
[2] Catholic Univ Louvain, ICTEAM, B-1348 Louvain, Belgium
[3] CEA Leti MINATEC, F-38054 Grenoble, France
[4] Univ Malaysia Perlis, Sch Microelect Eng, Kangar 01000, Perlis, Malaysia
关键词
Ultra-thin body and thin buried oxide FD; SOI MOSFETs; Parasitic capacitances; RF figures of merit; Asymmetric double gate; ANALOG FIGURES; GROUND PLANE; THIN-BOX; IMPACT; PERFORMANCE; DEVICES; PARAMETERS; FREQUENCY; BODY; DC;
D O I
10.1016/j.sse.2014.04.027
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work details the harmful effect of parasitic resistances and capacitances on RF figures of merit (FoM) of ultra-thin body and thin buried oxide (UTBB) FD SOI n-MOSFETs. It is demonstrated that intrinsically, UTBB device can reach very high cut-off frequency (f(T)) provided the reduction of parasitic elements. In addition, based on device simulation, we demonstrate that with appropriate configuration, Asymmetric Double Gate (ADG) regime provides a slight improvement of RF figures-of-merit. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:38 / 44
页数:7
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