Peritectic solidification of Cu-Sn alloys: Microstructural competition at low speed

被引：77

作者：

Kohler, F. ^{[1
]}

Germond, L. ^{[1
]}

Wagniere, J. -D. ^{[1
]}

Rappaz, M. ^{[1
]}

机构：

[1] Ecole Polytech Fed Lausanne, Computat Mat Lab, CH-1015 Lausanne, Switzerland

来源：

ACTA MATERIALIA | 2009年 / 57卷 / 01期

关键词：

Directional solidification; Peritectic solidification; Copper alloys; Nucleation and growth; Cooperative growth; PHASE-FIELD SIMULATIONS; DIRECTIONAL SOLIDIFICATION; COUPLED GROWTH; FLUID-FLOW; NI-ALLOYS; FE-C; SYSTEMS; TRANSFORMATION; SELECTION; DYNAMICS;

D O I：

10.1016/j.actamat.2008.08.058

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Directional solidification experiments on Cu-Sn peritectic alloys have been conducted at very low velocity in a high-thermal-gradient Bridgman furnace. The size of the samples has been reduced in order to decrease natural convection and the associated macrosegregation. At the lowest growth rates (0.5 and 0.58 mu m s(-1)), eutectic-like alpha + beta lamellar structures have been observed in near-peritectic composition alloys over several millimeters of growth. These structures resulted from a destabilization of a band structure in which alpha- and beta-phases overlay each other. Electron backscattered diffraction measurements revealed that bands and lamellae of a solid phase are continuous and originate from a single nucleus. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：56 / 68

页数：13

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