Increasing efficiency of a chemical-mechanical polishing of the silicon wafer

被引：0
|
作者：
Khmelev, Vladimir N. [1 ]
Shalunov, Andrey V. [1 ]
Smerdina, Elena S. [1 ]
机构：
[1] II Polzunov Altay State Tech Univ, Biysk Technol Inst, Biisk, Russia
来源：
EDM 2006: 7TH ANNUAL INTERNATIONAL WORKSHOP AND TUTORIALS ON ELECTRON DEVICES AND MATERIALS, PROCEEDINGS | 2006年
关键词：
semiconductors; chemical mechanical polishing; ultrasonic devices;
D O I：
暂无
中图分类号：
O42 [声学];
学科分类号：
070206 ; 082403 ;
摘要：
The present paper is concerned with the reasons of increasing the efficiency of one of the basic processes in manufacturing of semiconductors - chemical-mechanical polishing (CMP). The promising researches-and-experiments based way of the above problem solution by the application of ultrasonic spraying of a polishing liquid is offered. The paper reports the design which allows to embed the ultrasonic apparatus in the present equipment for CMP-process.
引用
收藏
页码：263 / +
页数：2
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