Thermal stability of slow and fast cure EVA encapsulant material for photovoltaic module manufacturing process

被引：55

作者：

Agroui, K.

Maallemi, A.

Boumaour, M.

Collins, G.

Salama, M.

机构：

[1] UDTS, Silicon Technol Dev Unit, Algiers, Algeria

[2] Mol Mat Sci, Maplewood, NJ 07040 USA

[3] Penn State Univ, Mat Res Lab, University Pk, PA 16802 USA

来源：

SOLAR ENERGY MATERIALS AND SOLAR CELLS | 2006年 / 90卷 / 15期

关键词：

EVA encapsulant; photovoltaic module; encapsulation process; thermal stability;

D O I：

10.1016/j.solmat.2006.03.023

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Ethylene vinyl acetate (EVA) is a copolymer encapsulant used as an interlayer in the industrial photovoltaic module encapsulation process. EVA serves to provide the functions of structural support, electrical isolation, physical isolation/protection and thermal conduction for the solar cell circuit. This paper focuses on thermal properties of slow and fast cure EVA encapsulant material. Phase transition and thermal stability parameters of uncured EVA materials have been studied by employing thermo gravimetric analysis, thermal differential analysis and differential scanning calorimetric. EVA fast cure encapsulant material exhibits superior thermal stability in the range of operational cell temperature. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：2509 / 2514

页数：6

共 12 条

[1] Characterisation of EVA encapsulant material by thermally stimulated current technique [J].