INVESTIGATION OF NUCLEATION AND PLATING OVERPOTENTIALS DURING COPPER ELECTROWINNING USING THE GALVANOSTATIC STAIRCASE METHOD

被引:0
|
作者
Moats, Michael S. [1 ]
Derrick, Alexander [1 ]
机构
[1] Univ Utah, Dept Met Engn, Salt Lake City, UT 84112 USA
来源
ELECTROMETALLURGY 2012 | 2012年
关键词
Copper; Electrodeposition; Overpotentials; Additives; ELECTRODEPOSIT MORPHOLOGY;
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The Winand Diagram was developed and has been used for decades to illustrate the interaction between polarization, mass transport and inhibition on the resulting structure of a metal electrodeposit. Recently, Adcock et al. criticized the Winand Diagram and developed their own structural diagram based on nucleation and plating overpotentials. Their work was based on zinc electrodeposition using a galvanostatic staircase method. This work explores the nucleation and plating overpotentials for copper electrodeposition using conditions typical for primary electrowinning and the galvanostatic staircase experimental technique. Additionally, the effects of organic additives and plating substrate on these overpotentials are reported.
引用
收藏
页码:127 / 137
页数:11
相关论文
共 7 条
  • [1] Stainless steel substrate pretreatment effects on copper nucleation and stripping during copper electrowinning
    Verbruggen, Florian
    Fiset, Erika
    Bonin, Luiza
    Prevoteau, Antonin
    Moats, Michael S.
    Hennebel, Tom
    Rabaey, Korneel
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 2021, 51 (02) : 219 - 233
  • [2] Stainless steel substrate pretreatment effects on copper nucleation and stripping during copper electrowinning
    Florian Verbruggen
    Erika Fiset
    Luiza Bonin
    Antonin Prévoteau
    Michael S. Moats
    Tom Hennebel
    Korneel Rabaey
    Journal of Applied Electrochemistry, 2021, 51 : 219 - 233
  • [3] Electropolymerized coatings of polyaniline on copper by using the galvanostatic method and their corrosion protection performance in HCl medium
    Shabani-Nooshabadi, Mehdi
    Mollahoseiny, Maryam
    Jafari, Yaser
    SURFACE AND INTERFACE ANALYSIS, 2014, 46 (07) : 472 - 479
  • [4] Investigation of the influence of plating additives on lattice defects in electrolytic copper using positron annihilation technique
    Shishido, I
    Matsuo, A
    Toyoyama, H
    Mizuno, M
    Araki, H
    Shirai, Y
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 2006, 70 (02) : 118 - 121
  • [5] Investigation of The Joining Interface of Copper-Titanium Bimetallic Composite Materials Manufactured Using Explosive Welding Method
    Yildirim, Mehmet Serkan
    Kaya, Yakup
    JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI, 2024, 27 (01):
  • [6] Investigation of Working Mechanism of Bis-(3-sulfopropyl) Disulfide (SPS) during Cu Electroless Deposition Using Real-Time Observation Method
    Min, Youn Ji
    Kim, Kwang Hwan
    Lim, Taeho
    Kim, Jae Jeong
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2017, 164 (14) : D1028 - D1033
  • [7] Investigation on laser cladding of Co-Ni coating on copper tube surface using a novel side-axis simultaneous powder feeding method
    Cheng, Peng
    Li, Guangshi
    Gao, Tianle
    Wang, Chali
    Zhao, Pengfei
    Pang, Zhongya
    Fu, Yongkang
    Yu, Xing
    Zou, Xingli
    Lu, Xionggang
    MATERIALS LETTERS, 2025, 384