High Heat Flux Removal Using Optimized Microchannel Heat Sink

被引：0

作者：

Zhang, Lei ^{[1
]}

Jones, Ben ^{[1
]}

Buja, Federico ^{[1
]}

Cherman, Vladimir ^{[1
]}

Oprins, Herman ^{[1
]}

Soussan, Philippe ^{[1
]}

机构：

[1] IMEC, Leuven, Belgium

来源：

2018 24TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC) | 2018年

关键词：

HIGH-PERFORMANCE; JET IMPINGEMENT; POWER; ELECTRONICS;

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

In this paper, we report on a silicon-based compact microchannel heat sink that enables high heat flux dissipation. Using advanced CMOS compatible silicon fabrication, high aspect ratio microchannels, 32 mu m wide and 160 mu m deep were realized. The heat sink was interfaced to a small 5.0 mm x 5.0 mm silicon-based thermal test chip. A very low thermal contact resistance between the heat sink and the heater die was achieved using an optimized Cu/Sn-Au interface. As a result, a low total thermal resistance of 0.36 K/W (9 mm(2)K/W) at the pump power of about 2 W was achieved on the assembled device. The design, fabrication, measurements on cooling performance and 3D modelling of the device are included in this paper.

引用

页数：6

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