High Heat Flux Removal Using Optimized Microchannel Heat Sink

被引：0
作者：
Zhang, Lei [1 ]
Jones, Ben [1 ]
Buja, Federico [1 ]
Cherman, Vladimir [1 ]
Oprins, Herman [1 ]
Soussan, Philippe [1 ]
机构：
[1] IMEC, Leuven, Belgium
来源：
2018 24TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC) | 2018年
关键词：
HIGH-PERFORMANCE; JET IMPINGEMENT; POWER; ELECTRONICS;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
In this paper, we report on a silicon-based compact microchannel heat sink that enables high heat flux dissipation. Using advanced CMOS compatible silicon fabrication, high aspect ratio microchannels, 32 mu m wide and 160 mu m deep were realized. The heat sink was interfaced to a small 5.0 mm x 5.0 mm silicon-based thermal test chip. A very low thermal contact resistance between the heat sink and the heater die was achieved using an optimized Cu/Sn-Au interface. As a result, a low total thermal resistance of 0.36 K/W (9 mm(2)K/W) at the pump power of about 2 W was achieved on the assembled device. The design, fabrication, measurements on cooling performance and 3D modelling of the device are included in this paper.
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页数：6
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