High Heat Flux Removal Using Optimized Microchannel Heat Sink

In this paper, we report on a silicon-based compact microchannel heat sink that enables high heat flux dissipation. Using advanced CMOS compatible silicon fabrication, high aspect ratio microchannels, 32 mu m wide and 160 mu m deep were realized. The heat sink was interfaced to a small 5.0 mm x 5.0 mm silicon-based thermal test chip. A very low thermal contact resistance between the heat sink and the heater die was achieved using an optimized Cu/Sn-Au interface. As a result, a low total thermal resistance of 0.36 K/W (9 mm(2)K/W) at the pump power of about 2 W was achieved on the assembled device. The design, fabrication, measurements on cooling performance and 3D modelling of the device are included in this paper.