Surface smoothing mechanism of AlN film by initially alternating supply of ammonia

被引:15
作者
Yan, FW
Tsukihara, M
Nakamura, A
Yadani, T
Fukumoto, T
Naoi, Y
Sakai, S
机构
[1] Univ Tokushima, Satellite Venture Business Lab, Tokushima 7708506, Japan
[2] Univ Tokushima, Fac Engn, Tokushima 7708506, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 2004年 / 43卷 / 8B期
关键词
AlN; MOCVD; TEM; AFM; wet chemical etching;
D O I
10.1143/JJAP.43.L1057
中图分类号
O59 [应用物理学];
学科分类号
摘要
A buffer technique that initially alternates supply of ammonia (IASA) is employed for AIN film growth on sapphire substrate by metalorganic chemical vapor deposition (MOCVD). Atomic force microscopy (AFM) study reveals that step-flow-like growth morphology is achieved for the AIN film with the root-mean-square (rms) roughness as small as 0336 nm. In contrast, the surface morphology of thick AIN film grown directly on sapphire substrate shows rough grainy feature with a large rms value of 28.9nm. The mechanism leading to superior morphology by introducing IASA process is investigated using transmission electron microscopy (TEM), hot wet chemical etching and scanning electron microscopy (SEM) techniques. Evidence is presented that their morphological differences are attributed to strain reduction and polarity inversion. The present work provides insight into the AIN epitaxial growth and indicates that IASA is an effective method to realize atomically smooth AIN film.
引用
收藏
页码:L1057 / L1059
页数:3
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