A comparative study on p- and n-channel MOSFET embedded pressure sensing structures integrated with current mirror readout circuitry

被引:0
作者
Kumar, Shashi [1 ]
Rathore, Pradeep Kamar [1 ]
Akhtar, Jamil [2 ]
机构
[1] Natl Inst Technol Meghalaya, Dept Elect & Commun Engn, Shillong, Meghalayn, India
[2] Cent Elect Engn Res Inst, Sensors & Nanotechnol Grp, Pilani, Rajasthan, India
来源
2016 IEEE STUDENTS' CONFERENCE ON ELECTRICAL, ELECTRONICS AND COMPUTER SCIENCE (SCEECS) | 2016年
关键词
CMOS; MEMS; current mirror circuit; pressure sensor; pezoresistive effect;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a comparative study on p-and n-channel MOSFET embedded current mirror integrated pressure sensing structures. The pressure sensing structure consists of three MOSFETs connected in a resistive loaded current mirror configuration. The input constant current source MOSFET of the current mirror acts as a reference transistor and the output MOSFETs are the strain sensing elements. The pressure sensing MOSFETs are embedded on a flexible silicon diaphragm for sensing the tensile and compressive stresses developed in the diaphragm under applied pressure. Current mirror pressure sensing circuits employing n- and p-channel MOSFETs were designed for an output current of 1 mA using standard 5 mu m CMOS technology. The piezoresistive effect in both n- and p-channel MOSFETs have been exploited for the calculation of strain induced carrier mobility variation under applied pressure. Simulation results show that under tensile stresses both n- and p-channel MOSFETs have high sensitivities of approximately 373 and 590 mV/MPa, respectively. However, the pressure sensitivity of the n- channel device is found to be much higher than that of p-channel MOSFET under compressive stresses and their sensitivities are found to be approximately 408 and 42 mV/MPa, respectively. The overall pressure sensitivities of n- and p-channel MOSFET based current mirror pressure sensing circuits have been found to be approximately 782 and 633 mV/MPa, respectively.
引用
收藏
页数:4
相关论文
共 11 条
  • [1] Piezoresistive characteristics of short-channel MOSFETs on (100) silicon
    Bradley, AT
    Jaeger, RC
    Suhling, JC
    O'Connor, KJ
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (09) : 2009 - 2015
  • [2] Microsensor integration into systems-on-chip
    Brand, Oliver
    [J]. PROCEEDINGS OF THE IEEE, 2006, 94 (06) : 1160 - 1176
  • [3] Technologies for cofabricating MEMS and electronics
    Fedder, Gary K.
    Howe, Roger T.
    Liu, Tsu-Jae King
    Quevy, Emmanuel P.
    [J]. PROCEEDINGS OF THE IEEE, 2008, 96 (02) : 306 - 322
  • [4] Biomedical microsystems for minimally invasive diagnosis and treatment
    Haga, Y
    Esashi, M
    [J]. PROCEEDINGS OF THE IEEE, 2004, 92 (01) : 98 - 114
  • [5] Mobility change of MOSFETs in a chip-stacked multichip package
    Ikeda, Akihiro
    Hamaguchi, Kiyoshi
    Ogi, Hiroshi
    Iwasaki, Kazuya
    Hattori, Reiji
    Kuroki, Yukinori
    [J]. ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 2006, 89 (07): : 1 - 8
  • [6] Khorgade M. P., 2011, 2011 UkSim 13th International Conference on Computer Modelling and Simulation (UKSim 2011), P522, DOI 10.1109/UKSIM.2011.106
  • [7] Recent Advances in MEMS Sensor Technology - Biomedical Applications
    Khoshnoud, Farbod
    de Silva, Clarence W.
    [J]. IEEE INSTRUMENTATION & MEASUREMENT MAGAZINE, 2012, 15 (01) : 8 - 14
  • [8] A novel CMOS-MEMS integrated pressure sensing structure based on current mirror sensing technique
    Rathore, Pradeep Kumar
    Panwar, Brishbhan Singh
    Akhtar, Jamil
    [J]. MICROELECTRONICS INTERNATIONAL, 2015, 32 (02) : 81 - 95
  • [9] Rathore PK, 2013, IEEE INTL CONF CONTR, P443, DOI 10.1109/CCA.2013.6662789
  • [10] Sedra A., 2019, MICROELECTRONIC CIRC