HiRel double sided package for Si/SiC power module

被引：2

作者：

Borowy, B. ^{[1
]}

Casey, L. ^{[1
]}

Davis, G. ^{[1
]}

Connell, J. ^{[2
]}

机构：

[1] SatCon Appl Technol, 27 Drydock Ave, Boston, MA 02210 USA

[2] SatCon Technol Co, Adv Thermal Technol, Boston, MA 02210 USA

来源：

2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUAL | 2006年

关键词：

D O I：

10.1109/RELPHY.2006.251288

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：613 / +

页数：2

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