HiRel double sided package for Si/SiC power module

被引：2
作者：
Borowy, B. [1 ]
Casey, L. [1 ]
Davis, G. [1 ]
Connell, J. [2 ]
机构：
[1] SatCon Appl Technol, 27 Drydock Ave, Boston, MA 02210 USA
[2] SatCon Technol Co, Adv Thermal Technol, Boston, MA 02210 USA
来源：
2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUAL | 2006年
关键词：
D O I：
10.1109/RELPHY.2006.251288
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：613 / +
页数：2
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