Galvanostatic and microscopic studies of nodulation during copper electrolysis

被引:10
作者
Lafront, AM [1 ]
Veilleux, B [1 ]
Ghali, E [1 ]
机构
[1] Univ Laval, Dept Min & Met, St Foy, PQ G1K 7P4, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
chloride additive; copper nodulation and refining; galvanostatic; glue; thiourea;
D O I
10.1023/A:1015589725641
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The galvanostatic technique on a laboratory scale has been shown to be a useful tool in detecting the presence of nodules on the cathode during copper electrodeposition by using the value of the starting electrolytic potential and by the presence of a cathodic polarization peak on the potential-time curve. Studying the morphology of the deposit with a scanning electron microscope at various magnifications confirmed the galvanostatic results. It is postulated that inappropriate concentrations and/or ratios of the additives (thiourea, gelatin and chloride ions) are associated with a certain current density that generates intergranular microcracks due to adsorption of the additives and leads to the formation of nodules at the macroscale.
引用
收藏
页码:329 / 337
页数:9
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