Investigation of flip-chip bonding for MEMS applications

被引：6

作者：

Salalha, W ^{[1
]}

Zussman, E

Bar-Yoseph, PZ

机构：

[1] Technion Israel Inst Technol, Fac Mech Engn, Mfg Syst Lab, IL-32000 Haifa, Israel

[2] Technion Israel Inst Technol, Fac Mech Engn, Computat Mech Lab, IL-32000 Haifa, Israel

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2004年 / 126卷 / 01期

关键词：

D O I：

10.1115/1.1646427

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

All investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices in which the solder volume is small (Bo much less than 1, where Bo is the Bond number), the finite element solution of the axisymmetric solder joint is well approximated by a surface of revolution whose generating meridian is a circular arc. Experimental results of solder joints in flip-chip assembly were found to correlate well with simulation results.

引用

页码：48 / 51

页数：4

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