Low-cost accelerometers: Two examples in thick-film technology

被引:20
作者
Crescini, D
Marioli, D
Taroni, A
机构
[1] Dept. of Electronics for Automation, University of Brescia, 25123 Brescia
关键词
acceleration measurements; thick-film technology; FEM analysis;
D O I
10.1016/S0924-4247(97)80060-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, two different piezoresistive thick-firm accelerometers are presented: a new high-sensitivity cantilever-type printed on a ferritic metal substrate and a ceramic twin-mass structure with an elevated figure of merit. Design and development are presented together with theoretical predictions and FEM analysis. Optimization procedures and limits are discussed in comparison with experimental results. The overall performance of the devices suggests that with proper control of screen-printing and firing processes, many applications in advanced industrial requirements will be possible in the near future.
引用
收藏
页码:79 / 85
页数:7
相关论文
共 22 条
[1]  
BELLUZZI O, 1984, SCI COSTRUZIONI, P273
[2]   SENSOR APPLICATIONS OF THICK-FILM TECHNOLOGY [J].
BRIGNELL, JE ;
WHITE, NM ;
CRANNY, AWJ .
IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION, 1988, 135 (04) :77-84
[3]  
BRUEL, 1972, MECH VIBRATING SHOCK, P50
[4]  
BUDE KR, 1983, IEEE T COMP, V4, P45
[5]  
CHITALE S, 1989, HYBRID CIRCUIT TECHN, V6, P45
[6]  
Crescini D., 1994, Proceedings of International Conference on Electronics Technologies, P265
[7]  
CRESCINI D, 1994, P IMEKO 12 WORLD C T, V1, P188
[8]  
FERRARI V, 1994, P 12 IMEKO WORLD C T, V3, P2098
[9]  
HOLMES PJ, 1976, HDB THICK FILM TECHN, P333
[10]  
Marioli D., 1993, 9th European Hybrid Microelectronic Conference Proceedings, P261