Electroless Ni-P coating on W-Cu alloy via potential activation process

被引：9
作者：
Wang, L. L. [1 ]
Chen, H. J. [1 ]
Huang, W. Q. [2 ]
Hao, L. [3 ]
机构：
[1] Xinyang Normal Univ, Coll Chem & Chem Engn, Xinyang 464000, Peoples R China
[2] Anhui Vocat & Tech Coll Ind & Trade, Huainan 232001, Peoples R China
[3] Chinese Acad Sci, Environm Corros Ctr, Inst Met Res, Shenyang 110016, Peoples R China
来源：
SURFACE ENGINEERING | 2009年 / 25卷 / 05期
关键词：
Electroless deposition; Ni-P coating; W-Cu alloy; Adhesion; Microhardness; Corrosion resistance; SINTERING BEHAVIOR; NICKEL; COMPOSITE; POWDERS;
D O I：
10.1179/026708408X375325
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Electroless Ni-P coating was deposited on W-Cu alloy via potential activation at -0.8 V. The coating was characterised for its morphology, structure, microhardness and the corrosion resistance. Scanning electron microscopy observation showed the presence of smooth and compact crystals in the coating. X-ray diffraction analysis showed that the Ni-P coating was amorphous in structure. The adhesion between Ni-P coating and W-Cu alloy was qualified. Heat treatment can improve the microhardness of Ni-P coating. Both the porosity test and immersion test in 10 vol.-% H2SO4 solution revealed that the Ni-P coating exhibited good corrosion resistance properties in protecting the W-Cu alloy.
引用
收藏
页码：376 / 381
页数：6
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