Etch and CMP process control using in-line AFM

As aspect ratios become higher, features become smaller, and requirements for planarity tighten, atomic force microscopy has begun to replace profilometry for topographic measurements such as trench and via depths, step height, and micro-planarity measurements, both in development and in production. The application of a high-throughput AFM for line monitoring in the STI and trench capacitor modules is described.