IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY

被引：0

作者：

不详

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2022年 / 12卷 / 11期

关键词：

D O I：

10.1109/TCPMT.2022.3228842

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Presents a listing of the editorial board, board of governors, current staff, committee members, and/or society editors for this issue of the publication.

引用

页码：C2 / C2

页数：1

共 50 条

[1] IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (05):
[2] IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (10):
[3] Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (12): : 2043 - 2045
[4] Welcome to the New IEEE Transactions on Components, Packaging, and Manufacturing Technology (T-CPMT)
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (01): : 3 - 3
[5] A publication of the ieee components, packaging, and manufacturing technology society
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IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2003, 26 (03): : 194 - 195
[6] IEEE Transactions on Electronics Packaging Manufacturing: Editorial
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[7] IEEE Transactions on Electronics Packaging Manufacturing: Editorial
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[8] IEEE Components, Packaging, and Manufacturing Technology Society information for authors
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (05):
[9] IEEE Transactions on Components and Packaging Technologies: Editorial
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[10] IEEE Transactions on Components and Packaging Technologies: Editorial
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