Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds

被引：16

作者：

Bhat, Kiran N. ^{[1
]}

Prabhu, K. N. ^{[1
]}

Satyanarayan ^{[1
]}

机构：

[1] Natl Inst Technol Karnataka, Dept Met & Mat Engn, Mangalore 575025, India

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2014年 / 25卷 / 02期

关键词：

PERCENT-CU SOLDER; MECHANICAL-PROPERTIES; JOINT RELIABILITY; LEAD; SURFACE; NI; LAYER;

D O I：

10.1007/s10854-013-1658-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of reflow temperature and substrate surface roughness on wettability, intermetallics and shear strength of Sn-3.8Ag-0.7Cu solder alloy on copper (Cu) substrate was studied. It was found that increase in reflow temperature and substrate surface roughness improved the wettability of solder alloy. The size of needle shaped Cu6Sn5 IMCs (intermetallic compounds) increased with increase in temperature. The morphology of IMCs transformed from long to short needles with increase in substrate roughness. Shear strength and shear energy of the solder bond on rough Cu surfaces were found to be higher than that on smooth Cu surfaces. However, the sheared surfaces of the solder bond on rough Cu surface exhibited a transition ridge characterised by sheared IMCs whereas solder bond on smooth Cu surfaces exhibited completely ductile failure. Although, rough surface exhibited higher shear strength and shear energy, smoother surface is preferable due to its predominant bond failure in the solder matrix.

引用

页码：864 / 872

页数：9

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