Analysis of RLC Interconnect Delay Considering Thermal Effect

被引：0

作者：

Dong, Gang ^{[1
]}

Leng, Peng ^{[1
]}

Yang, Yintang ^{[1
]}

Chai, Changchun ^{[1
]}

机构：

[1] Xidian Univ, Inst Microelect, Xian 710071, Peoples R China

来源：

2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4 | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Based on the equivalent Elmore delay model, a new delay model that takes inductance and thermal effect into consideration is presented in this paper. The proposed model with high efficiency has closed-form expression. Its solution exhibits high accuracy as compared to the other models. Simulation results show that the error in the propagation delay is less than 10% for RLC tree example.

引用

页码：2248 / 2251

页数：4

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