Analysis of RLC Interconnect Delay Considering Thermal Effect

被引:0
|
作者
Dong, Gang [1 ]
Leng, Peng [1 ]
Yang, Yintang [1 ]
Chai, Changchun [1 ]
机构
[1] Xidian Univ, Inst Microelect, Xian 710071, Peoples R China
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Based on the equivalent Elmore delay model, a new delay model that takes inductance and thermal effect into consideration is presented in this paper. The proposed model with high efficiency has closed-form expression. Its solution exhibits high accuracy as compared to the other models. Simulation results show that the error in the propagation delay is less than 10% for RLC tree example.
引用
收藏
页码:2248 / 2251
页数:4
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