A NEW HIGH-SENSITIVITY PACKAGE-LEAK TESTING METHOD FOR MEMS SENSORS

被引：2

作者：

Fujiyoshi, M. ^{[1
]}

Nonomura, Y. ^{[1
]}

Senda, H. ^{[2
]}

机构：

[1] Toyota Cent Res & Dev Labs Inc, Obu, Aichi, Japan

[2] Toyota Motor Co Ltd, Aichi, Japan

来源：

IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009) | 2009年

关键词：

D O I：

10.1109/MEMSYS.2009.4805488

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new high-sensitivity package-leak testing method has been developed for micro electro mechanical system (MEMS) sensors such as a vibrating angular-rate sensor housed in a vacuum package. Procedures of the method to obtain high leak-rate resolution are as follows. (1) A package filled with helium gas is kept in a small and closed chamber to accumulate helium gas leaking out of the package. (2) The chamber is chilled with liquid-N-2 after the accumulation to reduce background gases except the helium gas. (3) The helium gas is transported to a mass spectrometer in a short time and recorded as a transient waveform. The leak-rate resolution of 1x10(-17) Pa.m(3)/s was obtained. This resolution was 10(5) times superior to that of the conventional method.

引用

页码：737 / 740

页数：4