Effect of Temperature Cycling on Reliability of Flip Chip Solder Joint

被引：0

作者：

Jiang, Xueming ^{[1
]}

Lin, Pengrong ^{[1
]}

Song, Yuezhong ^{[1
]}

Huang, Yingzhuo ^{[1
]}

Lian, Binhao ^{[1
]}

Yao, Quanbin ^{[1
]}

机构：

[1] Beijing Aerosp Syst Engn Res Inst, Beijing Microelect Technol Inst, Beijing, Peoples R China

来源：

2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年

关键词：

Flip chip; Reliability; High temperature cycle; Underfill;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can effectively improve the thermal fatigue life of solder joints. The content of PbSn bumps in Sn has significant influence on the solder joint reliability.

引用

页码：989 / 991

页数：3

共 5 条

[1] Coffin-Manson fatigue model of underfilled flip-chips [J].

Gektin, V ;

BarCohen, A ;

Ames, J .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (03) :317-326

[2]

Lau J. H., 1996, FLIP CHIP TECHNOLOGI, P123

[3] Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure [J].

Nah, JW ;

Kim, JH ;

Lee, HM ;

Paik, KW .

ACTA MATERIALIA, 2004, 52 (01) :129-136

[4]

Zhang Fan, 2002, J ELECT MAT, V31

[5]

Zhenwei Hou, LEAD FREE SOLDER FLI

← 1 →