Finite element analysis of PWB warpage due to cured solder mask - Sensitivity analysis

被引：15

作者：

Ume, IC

Martin, T

机构：

[1] School of Mechanical Engineering, Georgia Institute of Technology, Atlanta

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1997年 / 20卷 / 03期

关键词：

coefficients of thermal expansion; finite element analysis; printed wiring assemblies; printed wiring board;

D O I：

10.1109/95.623025

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper describes the impact of different types of cured solder mask and mask thicknesses on printed wiring board (PWB) warpage, Finite element analysis (FEA) was used to study the sensitivity of board warpage to changes in the mask material properties (different types of solder mask), and to variations in mask thickness, The sensitivity analysis of the influence of cured solder mask and variations in mask thickness on PWB warpage are the focus of this paper, The study reported in this paper was carried out with four different board designs, and the results are presented here, The results of these analyses have resulted in general guidelines which should be observed when selecting masking materials.

引用

页码：307 / 316

页数：10