Analytical Investigation of the Limits for the In-Plane Thermal Conductivity Measurement Using a Suspended Membrane Setup

被引:9
作者
Linseis, V. [1 ]
Voelklein, F. [2 ]
Reith, H. [4 ]
Woias, P. [3 ]
Nielsch, K. [4 ]
机构
[1] Linseis Messgerate GmbH, Vielitzer Str 43, D-95100 Selb, Germany
[2] RheinMain Univ Appl Sci Wiesbaden, Inst Microtechnol, D-65428 Russelsheim, Germany
[3] Univ Freiburg, Dept Microsyst Engn IMTEK, Georges Koehler Allee 102, D-79110 Freiburg, Germany
[4] Leibniz Inst Solid State & Mat Res IFW Dresden, POB 270116, D-01171 Dresden, Germany
关键词
Thin film characterization; thermoelectrics; nanostructures; seebeck coefficient; thermal conductivity; resistivity; in-plane; ZT; THIN-FILMS;
D O I
10.1007/s11664-017-5989-4
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An analytical study has been performed on the measurement capabilities of a 100-nm thin suspended membrane setup for the in-plane thermal conductivity measurements of thin film samples using the 3 omega measurement technique, utilizing a COSMOL Multiphysics simulation. The maximum measurement range under observance of given boundary conditions has been studied. Three different exemplary sample materials, with a thickness from the nanometer to the micrometer range and a thermal conductivity from 0.4 W/mK up to 100 W/mK have been investigated as showcase studies. The results of the simulations have been compared to a previously published evaluation model, in order to determine the deviation between both and thereby the measurement limit. As thermal transport properties are temperature dependent, all calculations refer to constant room temperature conditions.
引用
收藏
页码:3203 / 3209
页数:7
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