Analyzing the collapse force of narrow lines measured by lateral force AFM using an analytical mechanical model

被引：8

作者：

Wostyn, Kurt ^{[1
]}

Kim, Tae-Gon ^{[2
]}

Mertens, Paul W. ^{[1
]}

Park, Jin-Goo ^{[2
]}

机构：

[1] IMEC VZW, Kapeldreef 75, B-3001 Louvain, Belgium

[2] Hanyang Univ, Div Mat Chem Engn, Ansan, South Korea

来源：

ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES IX: UCPSS 2008-9TH INTERNATIONAL SYMPOSIUM ON ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES (UCPSS) | 2009年 / 145-146卷

基金：

美国国家科学基金会;

关键词：

lateral force; normal stress; shear stress; elongation; damage mechanism;

D O I：

10.4028/www.scientific.net/SSP.145-146.55

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：55 / +

页数：3

共 9 条

[1]

CHRISTENSON K, 2004, 4 ANN FSI SURF COND

[2]

De Marco C., 2007, ECS transactions, V11, P87

[3] Size effect on the mechanical properties and reliability analysis of microfabricated polysilicon thin films [J].

Ding, JN ;

Meng, YG ;

Wen, SZ .

39TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM 2001, 2001, :106-111

[4]

Gere J. M., 1997, Mechanics of Materials, V4th

[5]

Kim T.-G., 2007, ECS T, V11, P123

[6]

KIM TG, 2008, SEM SURF PREP CLEAN

[7]

KIM TG, 2007, SEM SURF PREP CLEAN

[8]

TARDIF F, 2004, ELECTROCHEM SOC P 20, P153

[9]

WOSTYN K, 2007, SEM SURF PREP CLEAN

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