Lumped-distributed hybrids in 3D-MMIC technology

被引：8

作者：

Ng, CY ^{[1
]}

Chongcheawchamnan, M

Robertson, ID

机构：

[1] Univ Surrey, MSRG, Sch Elect & Phys Sci, Guildford GU2 7XH, Surrey, England

[2] Mahanakorn Univ Technol, MMRC, Bangkok, Thailand

来源：

IEE PROCEEDINGS-MICROWAVES ANTENNAS AND PROPAGATION | 2004年 / 151卷 / 04期

关键词：

D O I：

10.1049/ip-map:20040656

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A multilayer branch-fine coupler, rat-race hybrid and Wilkinson power divider are presented using 3D-MMIC technology with multiple BCB and metal layers on a GaAs substrate. The circuits are designed to operate in X-band and by using the lumped-distributed approach, together with highly miniaturised TFMS lines, these multilayer circuits have achieved as much as ten times size reduction in comparison to their conventional distributed form in microstrip. Techniques for compensating the unequal parasitic capacitance in asymmetrical MIM structures are described.

引用

页码：370 / 374

页数：5

共 5 条

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[4]

Robertson I. D., 2001, RFIC and MMIC Design and Technology

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