RF Interconnections for Paper Electronics

被引：4
作者：
Xie, Li [1 ]
Feng, Yi [1 ]
Yang, Geng [2 ]
Chen, Qiang [1 ]
Zheng, Li-Rong [2 ]
机构：
[1] Royal Inst Technol KTH, iPack Vinn Excellence Ctr, Sch Informat & Commun Technol, S-16440 Kista, Sweden
[2] Fudan Univ, Sch Informat Sci & Technol, Shanghai 200433, Peoples R China
来源：
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2015年 / 25卷 / 10期
关键词：
Capacitive coupling; inkjet printing; paper electronics; RF interconnection;
D O I：
10.1109/LMWC.2015.2468572
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low temperature and the fragility features of paper substrate require novel approach for the heterogeneous integration of silicon chip and printed components. In this letter, RF interconnection via capacitive coupling is proposed for printed paper electronics. Capacitive coupling combined with the printed transmission line is used as the signal channel and realizes chip-to-chip communication. Modulation such as orthogonal frequency-division multiplexing is used for multiple chips to share the same transmission channel and increase the data rate. The channel response of the RF interconnection is studied and the feasibility is evaluated.
引用
收藏
页码：684 / 686
页数：3
相关论文
共 17 条
  • [1] A New Contactless Assembly Method for Paper Substrate Antennas and UHF RFID Chips
    Alimenti, Federico
    Virili, Marco
    Orecchini, Giulia
    Mezzanotte, Paolo
    Palazzari, Valeria
    Tentzeris, Manos M.
    Roselli, Luca
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2011, 59 (03) : 627 - 637
  • [2] Advanced RF/baseband interconnect schemes for inter- and intra-ULSI communications
    Chang, MCF
    Verbauwhede, I
    Chien, C
    Xu, ZW
    Kim, JS
    Ko, JW
    Gu, Q
    Lai, BC
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2005, 52 (07) : 1271 - 1285
  • [3] Multi-Layer RF Capacitors on Flexible Substrates Utilizing Inkjet Printed Dielectric Polymers
    Cook, Benjamin S.
    Cooper, James R.
    Tentzeris, Manos M.
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2013, 23 (07) : 353 - 355
  • [4] Feng Y, 2011, DIGITAL FABRICATION 2011/ NIP27- 27TH INTERNATIONAL CONFERENCE ON DIGITAL PRINTING TECHNOLOGIES: TECHNICAL PROGRAMS AND PROCEEDINGS, 2011, P454
  • [5] Organic TFT array on a paper substrate
    Kim, YH
    Moon, DG
    Han, JI
    [J]. IEEE ELECTRON DEVICE LETTERS, 2004, 25 (10) : 702 - 704
  • [6] Liu Z., 2012, ADV MAT
  • [7] Electromagnetic Characterization of Paper-Glue Compound for System-in-Package on Paper (SiPoP) Future Developments
    Lolli, Francesca
    Virili, M.
    Orecchini, G.
    Dionigi, M.
    Alimenti, F.
    Mezzanotte, P.
    Roselli, L.
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2012, 22 (10) : 545 - 547
  • [8] 3 Gb/s AC, coupled chip-to-chip communication using a low swing pulse receiver
    Luo, L
    Wilson, JM
    Mick, SE
    Xu, J
    Zhang, L
    Franzon, PD
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2006, 41 (01) : 287 - 296
  • [9] 4 Gbps high-density AC coupled interconnection (Invited paper)
    Mick, S
    Wilson, J
    Franzon, P
    [J]. PROCEEDINGS OF THE IEEE 2002 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2002, : 133 - 140
  • [10] Low-Power Frequency Doubler in Cellulose-Based Materials for Harmonic RFID Applications
    Palazzi, Valentina
    Alimenti, Federico
    Mezzanotte, Paolo
    Virili, Marco
    Mariotti, Chiara
    Orecchini, Giulia
    Roselli, Luca
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2014, 24 (12) : 896 - 898
12