Effects of plasma power on the properties of low-k polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor

被引：21

作者：

Joo, J

Quan, YC

Jung, DG ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Dept Phys, Inst Basic Sci, Suwon 440746, South Korea

[2] Sungkyunkwan Univ, Dept Vacuum Sci & Engn, Suwon 440746, South Korea

来源：

JOURNAL OF MATERIALS RESEARCH | 2000年 / 15卷 / 01期

基金：

新加坡国家研究基金会;

关键词：

Polymerlike organic thin films;

D O I：

10.1557/JMR.2000.0037

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Effects of plasma power on the properties of polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor were studied. As the plasma power was increased from 5 to 60 W, the relative dielectric constant increased from 2.53 to 2.85. The film deposited at higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 400 degrees C. All the films were insulating under applied field less than or equal to 1 MV/cm.

引用

页码：228 / 230

页数：3