The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process

被引：13

作者：

Qi, L ^{[1
]}

Zhao, J ^{[1
]}

Wang, XM ^{[1
]}

Wang, L ^{[1
]}

机构：

[1] Dalian Univ Technol, Dalian 116024, Peoples R China

来源：

2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS | 2004年

关键词：

solder joint; aging; microstructure evolution; IMC layer;

D O I：

10.1109/BEPRL.2004.1308147

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The solder materials used to make the solder joints for this study are: eutectic Sn-3Ag-0.5Cu solder, Sn-3Ag-0.5Cu-1Bi solder, Sn-3Ag-0.5Cu-3Bi quaternary solder. In order to study the microstructures evolution and the growth kinetic of IMC, aging the solder joints isothermally in resistance oven at 150 +/- 5 V with different periods of 0, 50, 100, 250, 500, 1000hours. The result show that: the morphology of IMC become from scallop-like to planar in aging process, the mean thickness of IMC layer solder joints is found to increase linearly with the square root of aging time, namely the growth of IMC controlled by atom diffusion, the IMC growth rate decreased as Bi content increased, for the solders discussed above the comparative IMC growth rate sequence from fast to slow is Sn-3Ag-0.5Cu > Sn-3Ag-0.5Cu-1Bi > Sn-3Ag-MCu-Mi.

引用

页码：42 / 46

页数：5

共 11 条

[1] Lead-free solders in microelectronics [J].