Fabrication and characterization of capless In0.52AI0.48As/In0.53Ga0.47As HEMTs

被引:0
|
作者
Jang, Jae-Hyung [1 ]
Adesida, Ilesanmi
机构
[1] Univ Illinois, Micro & Nanotechnol Lab, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
[3] Gwangju Inst Sci & Technol, Dept Informat & Commun, Kwangju 500712, South Korea
关键词
D O I
10.1093/ietele/e89-c.8.1259
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Capless high electron mobility transistors (HEMTs) were fabricated and their DC and RF performances were characterized. Capless HEMTs did not have highly doped InGaAs cap layer so that gate recess process was not required in the fabrication of capless HEMTs. The electrical performances of the capless HEMTs were compared with those of conventional HEMTs with highly doped InGaAs cap layer. A typical 0.2 mu m capless HEMT exhibited a maximum transconductance of 805 mS/mm, a threshold voltage of -0.5 V, and a unity current gain cut-off frequency (f(T)) of 137 GHz. Capless HEMTs exhibited improved device uniformity compared with conventional HEMTs fabricated by wet gate recess technology.
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页码:1259 / 1262
页数:4
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