Liquid-liquid phase separation and solidification behavior of Al55Bi36Cu9 monotectic alloy with different cooling rates

被引：12
作者：
Bo, Lin [1 ]
Li, Shanshan [1 ]
Wang, Lin [1 ]
Wu, Di [1 ]
Zuo, Min [1 ]
Zhao, Degang [1 ]
机构：
[1] Univ Jinan, Sch Mat Sci & Engn, Jinan 250022, Shandong, Peoples R China
来源：
RESULTS IN PHYSICS | 2018年 / 8卷
关键词：
Al55Bi36Cu9 monotectic alloy; Core-shell structure; Liquid-liquid phase transformation; Solidification morphology; AL-BI; COMPOSITE COATINGS; MICROSTRUCTURE; RESISTIVITY;
D O I：
10.1016/j.rinp.2018.01.056
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The cooling rate has a significant effect on the solidification behavior and microstructure of monotectic alloy. In this study, different cooling rate was designed through casting in the copper mold with different bore diameters. The effects of different cooling rate on the solidification behavior of Al55Bi36Cu9 (at.%) immiscible alloy have been investigated. The liquid-liquid phase separation of Al55Bi36Cu9 immiscible alloy melt was investigated by resistivity test. The solidification microstructure and phase analysis of Al55Bi36Cu9 immiscible alloy were performed by the SEM and XRD, respectively. The results showed that the liquid-liquid phase separation occurred in the solidification of Al55Bi36Cu9 monotectic melt from 917 degrees C to 653 degrees C. The monotectic temperature, liquid phase separation temperature and immiscibility zone of Al55Bi36Cu9 monotectic alloy was lower than those of Al-Bi binary monotectic alloy. The solidification morphology of Al55Bi36Cu9 monotectic alloy was very sensitive to the cooling rate. The Al/Bi core-shell structure formed when Al55Bi36Cu9 melt was cast in the copper mold with a 8 mm bore diameter. (C) 2018 The Authors. Published by Elsevier B.V.
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收藏
页码：1086 / 1091
页数：6
相关论文
共 23 条
[1]   ELECTRICAL TRANSPORT-PROPERTIES OF THE LIQUID AL-CU ALLOYS [J].
BRETONNET, JL ;
AUCHET, J ;
GASSER, JG .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 1990, 117 :395-398
[2]   Liquid immiscibility and core-shell morphology formation in ternary Al-Bi-Sn alloys [J].
Dai, R. ;
Zhang, J. F. ;
Zhang, S. G. ;
Li, J. G. .
MATERIALS CHARACTERIZATION, 2013, 81 :49-55
[3]   One-Step Fabrication of Al/Sn-Bi Core-Shell Spheres via Phase Separation [J].
Dai, R. ;
Zhang, S. G. ;
Li, J. G. .
JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (12) :2458-2464
[4]   Microstructure evolution of phase separated Fe-Cu-Cr-C composite coatings by laser induction hybrid cladding [J].
Dai, Xiaoqin ;
Zhou, Shengfeng ;
Wang, Meifeng ;
Lei, Jianbo ;
Wang, Chunxia ;
Wang, Tao .
SURFACE & COATINGS TECHNOLOGY, 2017, 324 :518-525
[5]   Effect of substrate types on the microstructure and properties of Cu65Fe35 composite coatings by laser induction hybrid cladding [J].
Dai, Xiaoqin ;
Zhou, Shengfeng ;
Wang, Meifeng ;
Lei, Jianbo ;
Xie, Min ;
Chen, Hanning ;
Wang, Chunxia ;
Wang, Tao .
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 722 :173-182
[6]   Density-temperature properties of Ga-Sb alloy melt [J].
Geng, Haoran ;
Zhang, Guoling ;
Wang, Zhiming ;
Deng, Yanbo ;
Qin, Haiou .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2010, 98 (01) :227-232
[7]   Effect of melt superheating treatment on solidification structures of Al75Bi9Sn16 immiscible alloy [J].
Jia, Peng ;
Zhang, Jinyang ;
Geng, Haoran ;
Yang, Zhongxi ;
Teng, Xinying ;
Zhao, Degang ;
Wang, Yan ;
Zuo, Min ;
Sun, Ningqiang .
JOURNAL OF MOLECULAR LIQUIDS, 2017, 232 :457-461
[8]   Structure and electrical resistivity of liquid In-Sn alloy [J].
Korkmaz, S. D. ;
Korkmaz, S. .
COMPUTATIONAL MATERIALS SCIENCE, 2010, 48 (03) :466-470
[9]   The temperature dependence of resistivity and solidifying process of Al63Cu27Sn10 alloy [J].
Ma, Yuyao ;
Jia, Peng ;
Geng, Haoran ;
Yang, Zhongxi ;
Zuo, Min .
JOURNAL OF MOLECULAR LIQUIDS, 2017, 227 :291-294
[10]   Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap [J].
Ohnuma, I. ;
Saegusa, T. ;
Takaku, Y. ;
Wang, C. P. ;
Liu, X. J. ;
Kainuma, R. ;
Ishida, K. .
JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (01) :2-9
123