Microplastic Deformation of Submicrocrystalline Copper at Room and Elevated Temperatures

被引：0

作者：

Dudarev, E. F. ^{[1
]}

Pochivalova, G. P. ^{[1
]}

Tabachenko, A. N. ^{[1
]}

Maletkina, T. Yu. ^{[1
,2
]}

Skosyrskii, A. B. ^{[1
]}

Osipov, D. A. ^{[1
]}

机构：

[1] Natl Res Tomsk State Univ, Tomsk, Russia

[2] Tomsk State Univ Architecture & Bldg, Tomsk, Russia

来源：

RUSSIAN PHYSICS JOURNAL | 2017年 / 59卷 / 10期

关键词：

microplastic deformation; submicrocrystalline copper; grain boundary sliding; internal stress relaxation;

D O I：

10.1007/s11182-017-0948-3

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

of investigations of submicrocrystalline copper subjected to cold rolling after abc pressing by methods of backscatter electron diffraction and x-ray diffraction analysis are presented. It is demonstrated that after such combined intensive plastic deformation, the submicrocrystalline structure with average grain-subgrain structure elements having sizes of 0.63 mu m is formed with relative fraction of high-angle grain boundaries of 70% with texture typical for rolled copper. Results of investigation of microplastic deformation of copper with such structure at temperatures in the interval 295-473 K and with submicrocrystalline structure formed by cold rolling of coarse-grained copper are presented.

引用

页码：1589 / 1592

页数：4