On-chip decoupling capacitor optimization using architectural level prediction

被引:47
作者
Pant, MD [1 ]
Pant, P
Wills, DS
机构
[1] Intel Corp, Massachusetts Microproc Design Ctr, Shrewsbury, MA 01545 USA
[2] Georgia Inst Technol, Microelect Res Ctr, Atlanta, GA 30332 USA
关键词
decoupling capacitors; ground bounce; signal integrity;
D O I
10.1109/TVLSI.2002.1043335
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Switching activity-generated power-supply grid-noise presents a major obstacle to the reduction of supply voltage in future generation semiconductor technologies. A popular technique to counter this issue involves the usage of decoupling capacitors. This paper presents a novel design technique for sizing and placing on-chip decoupling capacitors based on activity signatures from the microarchitecture. Simulation of a typical processor workload (SPEC95) provides a realistic stimulation of microarchitecture elements that is coupled with a spatial power grid model. Evaluation of the proposed technique on typical microprocessor implementations (the Alpha 21264 and the Pentium II) indicates that this technique can produce up to a 30% improvement in maximum noise levels over a uniform decoupling capacitor placement strategy.
引用
收藏
页码:319 / 326
页数:8
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