Thermal modeling and performance of high heat flux SO packages

被引:14
作者
Arik, M
Garg, I [1 ]
Bar-Cohen, A
机构
[1] Thermal Syst Lab, GE Global Res Ctr Energy & Prop Technol, Niskayuna, NY 12309 USA
[2] Univ Maryland, Dept Mech Engn, Lab Thermal Packaging & Elect Syst, College Pk, MD 20742 USA
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2004年 / 27卷 / 02期
关键词
compact model; finite element method; high flux; liquid cooling; system-on-package (SOP);
D O I
10.1109/TADVP.2004.828816
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper explores the thermal challenges in advanced system-on-package (SOP) electronic structures, as well as candidate thermal solutions for these highly demanding cooling needs. The heat fluxes on the active surfaces are expected to approach 100 W/cm(2). The impact of this high flux is exacerbated by the relatively low thermal conductivity of the organic materials in SOP packaging. Detailed three-dimensional (3-D) finite-element simulations were used to study the temperature distributions in a typical SOP package, and to provide guidance for the development and implementation of "compact thermal models". These models were used to evaluate and compare the performance of various thermal technologies and to establish the most promising thermal management alternatives. The use of direct liquid cooling, by immersion of the components in inert, nontoxic, high dielectric strength perfluorocarbon liquids was seen to provide effective cooling over a range of anticipated SOP power dissipations.
引用
收藏
页码:398 / 412
页数:15
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