Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure

被引：22

作者：

Hsueh, Hao-Wen ^{[1
]}

Hung, Fei-Yi ^{[1
]}

Lui, Truan-Sheng ^{[1
]}

Chen, Li-Hui ^{[1
]}

Chen, Kuan-Jen ^{[2
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

[2] Natl Cheng Kung Univ, Instrument Ctr, Tainan 701, Taiwan

来源：

ADVANCES IN MATERIALS SCIENCE AND ENGINEERING | 2014年 / 2014卷

关键词：

COPPER WIRE; BALL BONDS;

D O I：

10.1155/2014/925768

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased. Observations of the Ag-Au-Pd wire after HTS (0-1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag-2 Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC. A high percentage of Pd and Au existed in this 200nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IMC growth. After PCT-1000 hr, a noncontinuous structure still remained between the IMC layer and interface, and the main phase of IMC was (Ag, Au, Pd)(2) Al with a hexagonal structure.

引用

页数：6

共 8 条

[1] New observations on intermetallic compound formation in gold ball bonds:: general growth patterns and identification of two forms of Au4Al [J].