Electroless Plating of Cu on Multi-walled Carbon Nanotubes

被引:0
作者
Dai, Rongrong [1 ]
Huang, Xinmin [1 ]
Fei, Zhangping [1 ]
机构
[1] Hefei Univ Technol, Dept Mat Sci & Engn, Hefei 230009, Anhui, Peoples R China
来源
ADVANCED MATERIALS AND PROCESSES III, PTS 1 AND 2 | 2013年 / 395-396卷
关键词
MWCNTs; electroless plating; oxidation; copper; deposition; NANOPARTICLES; DEPOSITION;
D O I
10.4028/www.scientific.net/AMM.395-396.154
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
A layer of densely distributed copper particles has been deposited on the surface of multi-walled carbon nanotubes (MWCNTs) by pretreatment including oxidation, sensitization and activation and electroless plating methods. Due to our experiments, the rate of deposition will increase by increasing the PH value and temperature of the solution bath properly. Different morphologies of coatings have been obtained with different PH values and temperatures. The most suitable PH value and temperature of the plating bath were 11.5 and 20 degrees C, respectively.
引用
收藏
页码:154 / 157
页数:4
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